CERAM PRO SYSTEMS
The CERAM PRO range relies on our proprietary MOVINGLight® DLP technology to directly print complex, porous ceramic cores in a single step; eliminating the need for tooling, wax pattern assembly, and the time-consuming manual operations traditionally associated with core production.
01. COMPLEXITY
Produce complex ceramic cores: including turbine blade cooling channels and other intricate internal geometries, impossible to achieve with conventional methods.
Produce complex ceramic cores: including turbine blade cooling channels and other intricate internal geometries, impossible to achieve with conventional methods.
02. EFFICIENCY
Reduce lead times and production costs by eliminating tooling and wax pattern assembly.
Reduce lead times and production costs by eliminating tooling and wax pattern assembly.
03. RELIABILITY
Maintain process repeatability from run to run, a critical factor for aerospace, defense, medical, and energy applications.
Maintain process repeatability from run to run, a critical factor for aerospace, defense, medical, and energy applications.
04. VERSATILITY
Benefit from an open materials platform, supporting a variety of ceramic compositions including SILICA SICAST 1200.
Benefit from an open materials platform, supporting a variety of ceramic compositions including SILICA SICAST 1200.
05. INTEGRATION
Integrate additive manufacturing into existing investment casting workflows with minimal disruption.
Integrate additive manufacturing into existing investment casting workflows with minimal disruption.
Once fired, cores reach the hardness required to withstand direct contact with high-temperature alloys, making CERAM PRO a proven solution for the production of critical components.
MEET OUR TEAM
Vincent ICART, CEO of Prodways Printers, and James BRADDICK, our US Sales Representative, will be available throughout the event to discuss technical applications and process integration.
Whether you are evaluating ceramic additive manufacturing for the first time or looking to industrialize an existing process, we are available for an in-depth technical discussion.
DETAILS
📍 ICI 73rd Technical Conference
October 26–27, 2026
DeVos Place, Grand Rapids, Michigan
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